BKP1005EM100-T [TAIYO YUDEN]
FERRITE BEAD 10 OHM 0402 1LN;
| 型号： | BKP1005EM100-T |
| 厂家： | 
TAIYO YUDEN (U.S.A.), INC |
| 描述： | FERRITE BEAD 10 OHM 0402 1LN |
| 文件： | 总23页 (文件大小：1582K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Notice for TAIYO YUDEN products
Please read this notice before using the TAIYO YUDEN products.
REMINDERS
Product Information in this Catalog
■
(4) Power generation control equipment (nuclear power,
hydroelectric power, thermal power plant control system, etc.)
(5) Undersea equipment (submarine repeating equipment,
underwater work equipment, etc.)
(6) Military equipment
(7) Any other equipment requiring extremely high levels of safety
and/or reliability equal to the equipment listed above
Product information in this catalog is as of October 2019. All of the
contents specified herein and production status of the products listed
in this catalog are subject to change without notice due to technical
improvement of our products, etc. Therefore, please check for the
latest information carefully before practical application or use of our
products.
Please note that TAIYO YUDEN shall not be in any way responsible
for any damages and defects in products or equipment incorporating
our products, which are caused under the conditions other than those
specified in this catalog or individual product specification sheets.
*Notes:
1. There is a possibility that our products can be used only
for aviation equipment that does not directly affect the safe
operation of aircraft (e.g., in-flight entertainment, cabin
light, electric seat, cooking equipment) if such use meets
requirements specified separately by TAIYO YUDEN. Please
be sure to contact TAIYO YUDEN for further information
before using our products for such aviation equipment.
2. Implantable medical devices contain not only internal unit
which is implanted in a body, but also external unit which is
connected to the internal unit.
Approval of Product Specifications
■
Please contact TAIYO YUDEN for further details of product
specifications as the individual product specification sheets are
available. When using our products, please be sure to approve our
product specifications or make a written agreement on the product
specification with TAIYO YUDEN in advance.
Pre-Evaluation in the Actual Equipment and Conditions
Please conduct validation and verification of our products in actual
conditions of mounting and operating environment before using our
products.
4. Limitation of Liability
■
■
Please note that unless you obtain prior written consent of TAIYO
YUDEN, TAIYO YUDEN shall not be in any way responsible for
any damages incurred by you or third parties arising from use of
the products listed in this catalog for any equipment that is not
intended for use by TAIYO YUDEN, or any equipment requiring
inquiry to TAIYO YUDEN or prohibited for use by TAIYO YUDEN
as described above.
Limited Application
1. Equipment Intended for Use
The products listed in this catalog are intended for general-
purpose and standard use in general electronic equipment (e.g.,
AV equipment, OA equipment, home electric appliances, office
equipment, information and communication equipment including,
without limitation, mobile phone, and PC) and other equipment
specified in this catalog or the individual product specification sheets.
Safety Design
■
When using our products for high safety and/or reliability-required
equipment or circuits, please fully perform safety and/or reliability
evaluation. In addition, please install (i) systems equipped with
a protection circuit and a protection device and/or (ii) systems
equipped with a redundant circuit or other system to prevent an
unsafe status in the event of a single fault for a failsafe design to
ensure safety.
TAIYO YUDEN has the line-up of the products intended for
use in automotive electronic equipment, telecommunications
infrastructure and industrial equipment, or medical devices
classified as GHTF Classes A to C (Japan Classes I to III).
Therefore, when using our products for these equipment,
please check available applications specified in this catalog
or the individual product specification sheets and use the
corresponding products.
Intellectual Property Rights
■
■
Information contained in this catalog is intended to convey examples
of typical performances and/or applications of our products and is
not intended to make any warranty with respect to the intellectual
property rights or any other related rights of TAIYO YUDEN or any
third parties nor grant any license under such rights.
2. Equipment Requiring Inquiry
Please be sure to contact TAIYO YUDEN for further information
before using the products listed in this catalog for the following
equipment (excluding intended equipment as specified in this
catalog or the individual product specification sheets) which may
cause loss of human life, bodily injury, serious property damage
and/or serious public impact due to a failure or defect of the
products and/or malfunction attributed thereto.
(1) Transportation equipment (automotive powertrain control
system, train control system, and ship control system, etc.)
(2) Traffic signal equipment
Limited Warranty
Please note that the scope of warranty for our products is limited to
the delivered our products themselves and TAIYO YUDEN shall not
be in any way responsible for any damages resulting from a failure
or defect in our products. Notwithstanding the foregoing, if there is
a written agreement (e.g., supply and purchase agreement, quality
assurance agreement) signed by TAIYO YUDEN and your company,
TAIYO YUDEN will warrant our products in accordance with such
agreement.
(3) Disaster prevention equipment, crime prevention equipment
(4) Medical devices classified as GHTF Class C (Japan Class III)
(5) Highly public information network equipment, data-
processing equipment (telephone exchange, and base
station, etc.)
TAIYO YUDEN’s Official Sales Channel
■
■
The contents of this catalog are applicable to our products which are
purchased from our sales offices or authorized distributors (hereinafter
“TAIYO YUDEN’s official sales channel”). Please note that the contents
of this catalog are not applicable to our products purchased from any
seller other than TAIYO YUDEN’s official sales channel.
(6) Any other equipment requiring high levels of quality and/or
reliability equal to the equipment listed above
3. Equipment Prohibited for Use
Caution for Export
Please do not incorporate our products into the following
equipment requiring extremely high levels of safety and/or
reliability.
Some of our products listed in this catalog may require specific
procedures for export according to“U.S. Export Administration
Regulations”,“Foreign Exchange and Foreign Trade Control Law”
of Japan, and other applicable regulations. Should you have any
questions on this matter, please contact our sales staff.
(1) Aerospace equipment (artificial satellite, rocket, etc.)
(2) Aviation equipment *1
(3) Medical devices classified as GHTF Class D (Japan Class IV),
implantable medical devices *2
20
for General Electronic Equipment
MULTILAYER CHIP BEAD INDUCTORS FOR POWER LINES(BK SERIES P TYPE)
WAVE＊
REFLOW
＊Except for BKP0603, BKP1005
■PARTS NUMBER
* Operating Temp.：-55～+85℃
△＝Blank space
B
K
P
1
6
0
8
H
S
1
8
1
－
⑤
T
△
⑦
①
②
③
④
⑥
①Series name
Code
④Nominal impedance
Series name
Code
（example）
330
Nominal impedance［Ω］
BKP
Multilayer chip bead inductor for power line
33
②Dimensions（L×W）
Code
101
100
390
Dimensions
Type（inch）
391
（L×W）［mm］
0603
1005
1608
2125
0603（0201）
1005（0402）
1608（0603）
2125（0805）
0.6×0.3
1.0×0.5
1.6×0.8
2.0×1.25
⑤Characteristics
Code
－
Characteristics
Standard
⑥Packaging
③Material
Code
HS
Code
T
Packaging
Taping
Material
⑦Internal code
HM
Refer to impedance curves
for material differences
Code
△
Internal code
Standard
TS
TM
EM
■STANDARD EXTERNAL DIMENSIONS / STANDARD QUANTITY
W
L
T
e
Standard quantity［pcs］
Type
L
W
T
e
Paper tape
Embossed tape
BKP0603
（0201）
0.6±0.03
（0.024±0.001）
1.0±0.05
0.3±0.03
（0.012±0.001）
0.5±0.05
0.3±0.03
0.15±0.05
15000
－
（0.012±0.001）
0.5±0.05
（0.006±0.002）
0.25±0.1
BKP1005
（0402）
10000
4000
4000
－
－
（0.039±0.002）
1.6±0.15
（0.020±0.002）
0.8±0.15
（0.020±0.002）
0.8±0.15
（0.010±0.004）
0.3±0.2
BKP1608
（0603）
（0.063±0.006）
2.0＋0.3/－0.1
（0.079＋0.012/－0.004）
（0.031±0.006）
1.25±0.2
（0.031±0.006）
0.85±0.2
（0.012±0.008）
0.5±0.3
BKP2125
（0805）
－
（0.049±0.008）
（0.033±0.008）
（0.020±0.012）
Unit：mm（inch）
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
20
115
for General Electronic Equipment
■PARTS NUMBER
●BKP0603
Nominal impedance
［Ω］
Measuring frequency
［MHz］
DC Resistance
［mΩ］（max.）
Rated current
［A］（max.）
Thickness
［mm］
Parts number
EHS
Impedance tolerance
BKP0603HS100-T
BKP0603HS220-T
BKP0603HS330-T
BKP0603HS800-T
BKP0603HS121-T
BKP0603HM100-T
BKP0603HM220-T
BKP0603HM330-T
BKP0603HM800-T
BKP0603HM121-T
BKP0603TS220-T
BKP0603TS330-T
BKP0603TM220-T
BKP0603TM330-T
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
10
22
33
80
120
10
22
33
80
120
22
33
22
33
±5Ω
±25％
±25％
±25％
±25％
±5Ω
100
100
100
100
100
100
100
100
100
100
100
100
100
100
30
65
1.3
1.0
1.0
1.0
0.85
1.3
1.0
1.0
1.0
0.80
1.8
1.5
1.8
1.5
0.30 ±0.03
0.30 ±0.03
0.30 ±0.03
0.30 ±0.03
0.30 ±0.03
0.30 ±0.03
0.30 ±0.03
0.30 ±0.03
0.30 ±0.03
0.30 ±0.03
0.30 ±0.03
0.30 ±0.03
0.30 ±0.03
0.30 ±0.03
70
120
150
30
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
70
70
120
180
40
55
40
55
●BKP1005
Nominal impedance
［Ω］
Measuring frequency
［MHz］
DC Resistance
［mΩ］（max.）
Rated current
［A］（max.）
Thickness
［mm］
Parts number
EHS
Impedance tolerance
BKP1005EM100-T
BKP1005EM300-T
BKP1005EM600-T
BKP1005EM121-T
BKP1005EM221-T
BKP1005EM331-T
BKP1005HS100-T
BKP1005HS330-T
BKP1005HS680-T
BKP1005HS121-T
BKP1005HS221-T
BKP1005HM121-T
BKP1005HM221-T
BKP1005TS330-T
BKP1005TS680-T
BKP1005TS121-T
BKP1005TM121-T
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
10
30
±5Ω
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
100
30
35
2.4
2.2
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
0.50 ±0.05
60
60
1.7
120
220
330
10
85
1.55
1.00
0.80
2.0
150
220
30
33
50
1.7
68
75
1.5
120
220
120
220
33
140
1.0
200
0.80
1.1
120
180
0.90
1.7
39±30％
55±30％
70±30％
100
68
1.5
120
120
1.3
1.3
●BKP1608
Nominal impedance
［Ω］
Measuring frequency
［MHz］
DC Resistance
［mΩ］（max.）
Rated current
［A］（max.）
Thickness
［mm］
Parts number
EHS
Impedance tolerance
BKP1608HS330-T
BKP1608HS600-T
BKP1608HS101-T
BKP1608HS121-T
BKP1608HS181-T
BKP1608HS271-T
BKP1608HS391-T
BKP1608HS471-T
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
RoHS
33
±25％
±25％
±25％
±25％
±25％
±25％
±25％
±25％
100
100
100
100
100
100
100
100
25
40
3.0
2.5
1.7
2.7
1.5
1.2
1.0
1.0
0.80 ±0.15
0.80 ±0.15
0.80 ±0.15
0.80 ±0.15
0.80 ±0.15
0.80 ±0.15
0.80 ±0.15
0.80 ±0.15
60
100
120
180
270
390
470
50
35
75
110
140
180
●BKP2125
Nominal impedance
［Ω］
Measuring frequency
［MHz］
DC Resistance
［mΩ］（max.）
Rated current
［A］（max.）
Thickness
［mm］
Parts number
EHS
Impedance tolerance
BKP2125HS330-T
BKP2125HS600-T
BKP2125HS101-T
BKP2125HS221-T
BKP2125HS331-T
RoHS
RoHS
RoHS
RoHS
RoHS
33
60
±25％
±25％
±25％
±25％
±25％
100
100
100
100
100
20
25
40
50
75
4.0
3.0
2.5
2.0
1.5
0.85 ±0.2
0.85 ±0.2
0.85 ±0.2
0.85 ±0.2
0.85 ±0.2
100
220
330
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
20
116
for General Electronic Equipment
■ ELECTRICAL CHARACTERISTICS
BKP0603
■
BKP0603 HS100
BKP0603 HS220
BKP0603 HS330
BKP0603 HS800
20
15
10
100
100
80
150
100
80
60
40
60
40
50
0
5
0
20
0
20
0
1
10
100
1000
10000
1
10
100
1000
10000
1
10
100
1000
10000
1
1
1
10
10
10
100
1000
1000
1000
10000
BKP0603 HS121
BKP0603 HM100
BKP0603 HM220
BKP0603 HM330
200
150
100
30
25
20
15
10
60
50
40
30
20
70
60
50
40
30
20
10
0
50
0
5
0
10
0
1
10
10
10
10
100
1000
1000
1000
1000
10000
10000
10000
1
10
10
10
100
1000
1000
1000
1000
10000
10000
10000
1
10
10
10
10
100
1000
1000
1000
1000
1000
10000
10000
10000
10000
10000
100
10000
BKP0603 HM800
BKP0603 HM121
BKP0603 TS220
BKP0603 TS330
200
150
100
250
200
150
100
35
30
25
20
15
10
5
50
45
40
35
30
25
20
15
10
50
0
50
0
5
0
0
1
1
1
100
1
1
1
100
1
100
100
10000
BKP1005
■
BKP1005 EM300
BKP0603 TM220
BKP0603 TM330
BKP1005 EM100
45
40
35
30
25
20
15
10
100
80
70
60
50
40
30
20
10
0
20
15
10
5
60
40
20
0
5
0
0
1
1
10
100
1000
10000
100
100
100
BKP1005 EM600
BKP1005 EM121
BKP1005 EM221
BKP1005 EM331
400
350
300
250
200
150
100
50
150
100
250
200
150
100
250
200
150
100
50
0
50
0
50
0
0
1
100
10000
10
100
10000
100
1
10
100
1000
10000
BKP1005 HS100
BKP1005 HS330
BKP1005 HS680
BKP1005 HS121
100
80
100
80
250
200
150
100
50
250
200
150
100
60
60
40
40
20
0
20
0
50
0
0
1
1
10
100
1000
10000
1
10
100
1000
10000
10
100
1
10
100
1000
10000
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
20
117
for General Electronic Equipment
■ ELECTRICAL CHARACTERISTICS
BKP1005 HS221
BKP1005 HM121
BKP1005 HM221
BKP1005 TS330
500
400
300
200
250
500
400
300
200
100
80
200
150
100
60
40
100
0
50
0
100
0
20
0
1
1
1
10
100
1000
1000
1000
10000
10000
10000
1
10
100
1000
10000
1
1
1
1
10
10
10
100
1000
1000
1000
1000
10000
10000
10000
10000
1
10
100
1000
1000
1000
10000
BKP1608
■
BKP1608 HS330
BKP1005 TS680
BKP1005 TS121
BKP1005 TM121
100
80
250
200
150
100
250
200
150
100
500
400
300
200
60
40
20
50
0
50
0
100
0
0
1
10
100
10000
10
100
1
10
100
1000
10000
100
BKP1608 HS600
BKP1608 HS101
BKP1608 HS121
BKP1608 HS181
100
80
250
200
150
100
250
200
150
100
500
400
300
200
100
60
40
20
0
50
0
50
0
0
1
10
100
100
1
10
100
1000
10000
10
100
10000
BKP2125
■
BKP1608 HS271
BKP1608 HS391
BKP1608 HS471
BKP2125 HS330
500
250
0
700
600
100
500
400
300
200
500
400
50
300
200
100
0
100
0
0
1
10
100
1000
1
10
100
1000
10000
10
100
1
10
100
1000
10000
BKP2125 HS600
BKP2125 HS101
BKP2125 HS221
BKP2125 HS331
100
500
500
500
250
50
250
250
0
0
0
0
1
1
10
100
1000
1
10
100
1000
10
100
1000
1
10
100
1000
▶ꢀThisꢀcatalogꢀcontainsꢀtheꢀtypicalꢀspecificationꢀonlyꢀdueꢀtoꢀtheꢀlimitationꢀofꢀspace.ꢀꢀWhenꢀyouꢀconsiderꢀtheꢀpurchaseꢀofꢀourꢀproducts,ꢀpleaseꢀcheckꢀourꢀproductꢀspecificationꢀsheets.ꢀ
ꢀ
Forꢀdetailsꢀofꢀeachꢀproductꢀ(characteristicsꢀgraph,ꢀreliabilityꢀinformation,ꢀprecautionsꢀforꢀuse,ꢀandꢀsoꢀon),ꢀseeꢀourꢀwebsiteꢀ(http://www.ty-top.com/)ꢀ.ꢀ
20
118
Multilayer chip inductors
Multilayer chip inductors for high frequency, Multilayer chip bead inductors
Multilayer common mode choke coils（MC series F type）
Metal Multilayer Chip Power Inductors (MCOILTM MC series)
■PACKAGING
①Minimum Quantity
●Tape & Reel Packaging
Standard Quantity ［pcs］
Thickness
mm（inch）
Type
CK1608（0603）
CK2125（0805）
Paper Tape
Embossed Tape
－
0.8 （0.031）
0.85（0.033）
1.25（0.049）
0.85（0.033）
1.25（0.049）
0.8 （0.031）
0.9 （0.035）
0.9 （0.035）
0.7 （0.028）
0.9 （0.035）
1.1 （0.043）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
1.25（0.049）
0.3 （0.012）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
1.0 （0.039）
0.3 （0.012）
0.3 （0.012）
0.5 （0.020）
0.3 （0.012）
0.5 （0.020）
0.3 （0.012）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
1.25（0.049）
0.45（0.018）
0.8 （0.031）
0.3 （0.012）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
0.3 （0.012）
0.4 （0.016）
0.55（0.022）
0.45（0.018）
0.55（0.022）
0.5 （0.020）
0.6 （0.024）
0.65（0.026）
0.8 （0.031）
1.0 （0.039）
0.8 （0.031）
1.0 （0.039）
4000
4000
－
－
2000
－
4000
－
CKS2125（0805）
2000
－
CKP1608（0603）
CKP2012（0805）
CKP2016（0806）
4000
－
3000
3000
3000
3000
2000
－
－
－
CKP2520（1008）
－
－
LK1005（0402）
LK1608（0603）
10000
4000
4000
－
－
－
LK2125（0805）
2000
－
HK0603（0201）
HK1005（0402）
HK1608（0603）
15000
10000
4000
－
－
－
4000
3000
－
HK2125（0805）
－
HKQ0603S（0201）
HKQ0603U（0201）
AQ105（0402）
15000
15000
10000
15000
10000
15000
10000
4000
4000
－
－
－
BK0603（0201）
BK1005（0402）
BKH0603（0201）
BKH1005（0402）
BK1608（0603）
－
－
－
－
－
－
BK2125（0805）
2000
－
BK2010（0804）
4000
－
BK3216（1206）
4000
－
BKP0603（0201）
BKP1005（0402）
BKP1608（0603）
BKP2125（0805）
MCF0605（0202）
MCF0806（0302）
MCF1210（0504）
MCF2010（0804）
MCEE1005（0402）
MCEK1210(0504)
MCFK1608（0603）
MCFE1608（0603）
MCHK1608(0603)
MCKK1608（0603）
MCHK2012（0806）
MCKK2012（0805）
15000
10000
4000
4000
15000
－
－
－
－
－
10000
5000
4000
－
－
－
10000
5000
4000
4000
4000
－
－
－
－
3000
－
4000
-
3000
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E08R01
②Taping material
●Card board carrier tape
CK
1608
1608
2125
2125
1005
1608
2125
0603
1005
1608
0603
105
BK
0603
1005
1608
2125
2010
0603
1005
1608
2125
0603
1005
0605
1005
1210
1608
2012
Top tape
CKP
CK
BK
BK
CKS
LK
BK
BK
LK
BKP
BKP
BKP
BKP
BKH
BKH
MCF
MC
Base tape
LK
HK
HK
HK
Sprocket hole
Chip cavity
HKQ
AQ
Bottom tape
MC
MC
Chip Filled
MC
Chip
●Embossed Tape
Top tape
CK
2125
2125
2012
2016
2520
2125
2125
BK
2125
3216
0806
1210
2010
1608
2012
CKS
CKP
CKP
CKP
LK
BK
MCF
MCF
MCF
MC
HK
MC
Sprocket hole
Chip cavity
Base tape
Chip Filled
Chip
③Taping Dimensions
●Paper tape (8mm wide)
Unit：mm（inch）
T
1.75±0.1
φ1.5＋0.1/－0
(φ0.059＋0.004/-0)
(0.069±0.004）
Sprocket hole
A
B
4.0±0.1
(0.157±0.004)
2.0±0.05
F
(0.079±0.002)
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E08R01
Chip cavity
Insertion Pitch
Ｆ
Tape Thickness
Ｔ
Thickness
mm（inch）
Type
Ａ
Ｂ
1.0±0.2
1.8±0.2
4.0±0.1
1.1max
CK1608（0603）
CK2125（0805）
CKS2125（0805）
CKP1608（0603）
LK1005（0402）
LK1608（0603）
LK2125（0805）
HK0603（0201）
HK1005（0402）
HK1608（0603）
HKQ0603S（0201）
HKQ0603U（0201）
AQ105（0402）
0.8 （0.031）
0.85（0.033）
0.85（0.033）
0.8 （0.031）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
0.3 （0.012）
0.5 （0.020）
0.8 （0.031）
0.3 （0.012）
0.3 （0.012）
0.5 （0.020）
0.3 （0.012）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
0.45（0.018）
0.3 （0.012）
0.5 （0.020）
0.8 （0.031）
0.85（0.033）
0.3 （0.012）
0.5 （0.020）
0.3 （0.012）
0.6 （0.024）
0.55（0.021）
0.5 （0.020）
0.6 （0.024）
0.65（0.026）
0.8 （0.031）
0.8 （0.031）
（0.039±0.008）
1.5±0.2
（0.071±0.008）
2.3±0.2
（0.157±0.004）
4.0±0.1
（0.043max）
1.1max
（0.059±0.008）
1.5±0.2
（0.091±0.008）
2.3±0.2
（0.157±0.004）
4.0±0.1
（0.043max）
1.1max
（0.059±0.008）
1.0±0.2
（0.091±0.008）
1.8±0.2
（0.157±0.004）
4.0±0.1
（0.043max）
1.1max
（0.039±0.008）
0.65±0.1
（0.071±0.008）
1.15±0.1
（0.157±0.004）
2.0±0.05
（0.043max）
0.8max
（0.026±0.004）
1.0±0.2
（0.045±0.004）
1.8±0.2
（0.079±0.002）
4.0±0.1
（0.031max）
1.1max
（0.039±0.008）
1.5±0.2
（0.071±0.008）
2.3±0.2
（0.157±0.004）
4.0±0.1
（0.043max）
1.1max
（0.059±0.008）
0.40±0.06
（0.091±0.008）
0.70±0.06
（0.157±0.004）
2.0±0.05
（0.043max）
0.45max
（0.016±0.002）
0.65±0.1
（0.028±0.002）
1.15±0.1
（0.079±0.002）
2.0±0.05
（0.018max）
0.8max
（0.026±0.004）
1.0±0.2
（0.045±0.004）
1.8±0.2
（0.079±0.002）
4.0±0.1
（0.031max）
1.1max
（0.039±0.008）
0.40±0.06
（0.071±0.008）
0.70±0.06
（0.157±0.004）
2.0±0.05
（0.043max）
0.45max
（0.016±0.002）
0.40±0.06
（0.028±0.002）
0.70±0.06
（0.079±0.002）
2.0±0.05
（0.018max）
0.45max
（0.016±0.002）
0.75±0.1
（0.028±0.002）
1.15±0.1
（0.079±0.002）
2.0±0.05
（0.018max）
0.8max
（0.030±0.004）
0.40±0.06
（0.045±0.004）
0.70±0.06
（0.079±0.002）
2.0±0.05
（0.031max）
0.45max
BK0603（0201）
BK1005（0402）
BK1608（0603）
BK2125（0805）
BK2010（0804）
BKP0603（0201）
BKP1005（0402）
BKP1608（0603）
BKP2125（0805）
BKH0603（0201）
BKH1005（0402）
MCF0605（0202）
MCFK1608（0603）
MCEE1005（0402）
MCEK1210（0504）
MCFK1608（0603）
MCFE1608（0603）
MCHK1608（0603）
MCHK2012（0805）
（0.016±0.002）
0.65±0.1
（0.028±0.002）
1.15±0.1
（0.079±0.002）
2.0±0.05
（0.018max）
0.8max
（0.026±0.004）
1.0±0.2
（0.045±0.004）
1.8±0.2
（0.079±0.002）
4.0±0.1
（0.031max）
1.1max
（0.039±0.008）
1.5±0.2
（0.071±0.008）
2.3±0.2
（0.157±0.004）
4.0±0.1
（0.043max）
1.1max
（0.059±0.008）
1.2±0.1
（0.091±0.008）
2.17±0.1
（0.157±0.004）
4.0±0.1
（0.043max）
0.8max
（0.047±0.004）
0.40±0.06
（0.085±0.004）
0.70±0.06
（0.157±0.004）
2.0±0.05
（0.031max）
0.45max
（0.016±0.002）
0.65±0.1
（0.028±0.002）
1.15±0.1
（0.079±0.002）
2.0±0.05
（0.018max）
0.8max
（0.026±0.004）
1.0±0.2
（0.045±0.004）
1.8±0.2
（0.079±0.002）
4.0±0.1
（0.031max）
1.1max
（0.039±0.008）
1.5±0.2
（0.071±0.008）
2.3±0.2
（0.157±0.004）
4.0±0.1
（0.043max）
1.1max
（0.059±0.008）
0.40±0.06
（0.091±0.008）
0.70±0.06
（0.157±0.004）
2.0±0.05
（0.043max）
0.45max
（0.016±0.002）
0.65±0.1
（0.028±0.002）
1.15±0.1
（0.079±0.002）
2.0±0.05
（0.018max）
0.8max
（0.026±0.004）
0.62±0.03
（0.045±0.004）
0.77±0.03
（0.079±0.002）
2.0±0.05
（0.031max）
0.45max
（0.024±0.001）
1.1±0.05
（0.030±0.001）
1.9±0.05
（0.079±0.002）
4.0±0.1
（0.018max）
0.72max
（0.043±0.002）
0.8±0.05
（0.075±0.002）
1.3±0.05
（0.157±0.004）
2.0±0.05
(0.028max)
0.64max
(0.031±0.002)
1.3±0.1
(0.051±0.002)
1.55±0.1
（0.079±0.002）
4.0±0.1
(0.025max)
0.64max
（0.051±0.004）
1.1±0.05
（0.061±0.004）
1.9±0.05
（0.157±0.004）
4.0±0.1
(0.025max)
0.72max
（0.043±0.002）
1.1±0.05
（0.075±0.002）
1.9±0.05
（0.157±0.004）
4.0±0.1
(0.028max)
0.72max
（0.043±0.002）
1.2±0.05
（0.075±0.002）
2.0±0.05
（0.157±0.004）
4.0±0.1
(0.028max)
0.9max
（0.047±0.002）
1.65±0.1
（0.079±0.002）
2.4±0.1
（0.157±0.004）
4.0±0.1
(0.035max)
0.9max
（0.065±0.004）
（0.094±0.004）
（0.157±0.004）
（0.035max）
Unit : mm（inch）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E08R01
●Embossed Tape (8mm wide)
φ1.5＋0.1/－0
Unit：mm（inch）
1.75±0.1
(0.069±0.004）
(φ0.059＋0.004/-0)
Sprocket hole
A
B
4.0±0.1
(0.157±0.004)
2.0±0.05
F
(0.079±0.002)
Chip cavity
Insertion Pitch
Ｆ
Tape Thickness
Thickness
mm（inch）
Type
Ａ
Ｂ
K
T
1.5±0.2
2.3±0.2
4.0±0.1
2.0
（0.079）
2.0
0.3
CK2125（0805）
CKS2125（0805）
CKP2012（0805）
CKP2016（0806）
1.25（0.049）
1.25（0.049）
0.9 （0.035）
0.9 （0.035）
0.7 （0.028）
0.9 （0.035）
1.1 （0.043）
1.1 （0.043）
1.25（0.049）
0.85（0.033）
1.0 （0.039）
1.25（0.049）
0.8 （0.031）
0.4 （0.016）
0.55（0.022）
0.45（0.018）
1.0 （0.039）
1.0 （0.039）
（0.059±0.008）
1.5±0.2
（0.091±0.008）
2.3±0.2
（0.157±0.004）
4.0±0.1
（0.012）
0.3
（0.059±0.008）
1.55±0.2
（0.091±0.008）
2.3±0.2
（0.157±0.004）
4.0±0.1
（0.079）
1.3
（0.012）
0.3
（0.061±0.008）
1.8±0.1
（0.091±0.008）
2.2±0.1
（0.157±0.004）
4.0±0.1
（0.051）
1.3
（0.012）
0.25
（0.071±0.004）
（0.087±0.004）
（0.157±0.004）
（0.051）
1.4
（0.01）
（0.055）
1.4
（0.055）
1.7
2.3±0.1
2.8±0.1
4.0±0.1
0.3
CKP2520（1008）
（0.091±0.004）
（0.110±0.004）
（0.157±0.004）
（0.012）
（0.067）
1.7
（0.067）
2.0
1.5±0.2
2.3±0.2
4.0±0.1
0.3
LK2125（0805）
HK2125（0805）
（0.059±0.008）
（0.091±0.008）
（0.157±0.004）
（0.079）
1.5
（0.012）
（0.059）
2.0
1.5±0.2
2.3±0.2
4.0±0.1
0.3
（0.059±0.008）
（0.091±0.008）
（0.157±0.004）
（0.012）
（0.079）
2.0
1.5±0.2
（0.059±0.008）
1.9±0.1
2.3±0.2
（0.091±0.008）
3.5±0.1
4.0±0.1
（0.157±0.004）
4.0±0.1
0.3
（0.012）
0.3
BK2125（0805）
（0.079）
1.4
BK3216（1206）
（0.075±0.004）
0.75±0.05
（0.138±0.004）
0.95±0.05
（0.157±0.004）
2.0±0.05
（0.055）
0.55
（0.012）
0.3
MCF0806（0302）
MCF1210（0504）
MCF2010（0804）
MCKK1608（0603）
MCKK2012（0805）
（0.030±0.002）
1.15±0.05
（0.037±0.002）
1.40±0.05
（0.079±0.002）
4.0±0.1
（0.022）
0.65
（0.012）
0.3
（0.045±0.002）
1.1±0.1
（0.055±0.002）
2.3±0.1
（0.157±0.004）
4.0±0.1
（0.026）
0.85
（0.012）
0.3
（0.043±0.004）
1.1±0.1
（0.091±0.004）
1.95±0.1
（0.157±0.004）
4.0±0.1
（0.033）
1.4
（0.012）
0.25
（0.043±0.004）
1.55±0.1
（±0.004）
（0.157±0.004）
4.0±0.1
（0.055）
1.35
（0.01）
0.25
2.35±0.1
（0.061±0.004）
（0.093±0.004）
（0.157±0.004）
（0.053）
（0.010）
Unit : mm（inch）
④LEADER AND BLANK PORTION
Blank portion
Chip cavity
Blank portion
Leader
100mm or more
(3.94inches or more)
160mm or more
(6.3inches or more)
400mm or more
(15.7inches or more)
Direction of tape feed
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E08R01
⑤Reel Size
t
E
C
B
A
R
D
W
A
B
C
D
E
R
φ178±2.0
φ50 or more
φ13.0±0.2
φ21.0±0.8
2.0±0.5
1.0
t
W
4mm width tape
8mm width tape
1.5max.
2.5max.
5±1.0
10±1.5
(Unit : mm)
⑥Top tape strength
The top tape requires a peel-off force of 0.1～0.7N in the direction of the arrow as illustrated below.
Pull direction
0～15°
Top tape
Base tape
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_pack_e-E08R01
Multilayer chip inductors
Multilayer chip inductors for high frequency, Multilayer chip bead inductors
Multilayer common mode choke coils（MC series F type）
Metal Multilayer Chip Power Inductors (MCOILTM MC series)
■RELIABILITY DATA
1. Operating Temperature Range
BK series
－55～＋125℃
BKH series
BKP series
MCF series
CK series
－55～＋85℃
－40～＋85℃
CKS series
CKP series
LK series
－40～＋85℃
Specified Value
HK0603, HK1005
HK1608, HK2125
HKQ0603
－55～＋125℃
－40～＋85℃
－55～＋125℃
AQ105
MCOILTM MC series
－40～＋125℃（Including self-generated heat）
2. Storage Temperature Range
BK series
－55～＋125℃
BKH series
BKP series
－55～＋85℃
－40～＋85℃
MCF series
CK series
CKS series
－40～＋85℃
Specified Value
CKP series
LK series
HK0603, HK1005
HK1608, HK2125
HKQ0603
－55～＋125℃
－40～＋85℃
－55～＋125℃
－40～＋85℃
AQ105
MCOILTM MC series
3. Rated Current
BK series
The temperature of the element is increased within 20℃.
BKH series
BKP series
MCF series
CK series
The temperature of the element is increased within 40℃
Refer to each specification.
The temperature of the element is increased within 20℃.
CKS series
CKP series
LK series
The temperature of the element is increased within 40℃
The decreasing-rate of inductance value is within 5 %
Specified Value
HK0603, HK1005
HK1608, HK2125
HKQ0603
The decreasing-rate of inductance value is within 5 %, or the temperature of the element is
increased within 20℃
AQ105
Idc1: The decreasing-rate of inductance value is within 30 %
Idc2: The temperature of the element is increased within 40℃
MCOILTM MC series
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E08R01
4. Impedance
BK series
BKH series
Specified Value
Refer to each specification.
BKP series
MCF series
BK0603Series, BKP0603Series, BKH Series
Measuring frequency
Measuring equipment
Measuring jig
: 100±1MHz
: 4991A（or its equivalent）
: 16193A（or its equivalent）
BK1005Series, BKP1005Series ,BKH1005Series
Measuring frequency
Measuring equipment
Measuring jig
: 100±1MHz
: 4291A（or its equivalent）
:
16192A （ or its equivalent ） , HW:16193A （ or its
equivalent）
Test Methods and BK1608・2125Series, BKP1608・2125Series
Remarks
Measuring frequency
Measuring equipment
Measuring jig
: 100±1MHz
: 4291A（or its equivalent）, 4195A（or its equivalent）
: 16192A（or its equivalent）, HW:16193A（or its equivalent）
BK2010・3216Series
Measuring frequency
Measuring equipment
Measuring jig
: 100±1MHz
: 4291A（or its equivalent）, 4195A（or its equivalent）
: 16192A（or its equivalent）
MCF Series
Measuring frequency
Measuring equipment
: 100±1MHz
: 4291A（or its equivalent）
5. Inductance
CK series
CKS series
CKP series
LK series
Specified Value
HK0603, HK1005
HK1608, HK2125
HKQ0603
Refer to each specification.
AQ105
MCOILTM MC series
CK、CKS、LK Series
Measuring frequency
Measuring equipment /jig
: Refer to each specification.
: 1608,2125⇒4294A＋16092A（or its equivalent）
1005⇒4291A＋16193A（or its equivalent）
: 047～4.7μH ⇒1mArms 、 5.6～33μH ⇒0.1mArms
Measuring current
CKP、MCOILTM MC Series
Measuring frequency
Measuring equipment
: 1MHz
: 4285A（or its equivalent）
Test Methods and
Remarks
HK0603、HK1005、AQ Series
Measuring frequency
: 100MHz
Measuring equipment /jig
: HK0603⇒ E4991A+16197A（or its equivalent） , AQ105⇒4291A＋16197A（or its equivalent）
HK1005⇒ 4291A＋16193A（or its equivalent）
HK1608、HK2125 Series
Measuring frequency
Measuring equipment /jig
HKQ Series
: ～100nH⇒100MHz 、120nH～⇒50MHz
: 4291A＋16092A（or its equivalent）
Measuring frequency
Measuring equipment /jig
: 500MHz
: E4991A＋16197A（or its equivalent）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E08R01
6. Q
CK series
CKS series
－
CKP series
LK series
Specified Value
HK0603, HK1005
HK1608, HK2125
HKQ0603
Refer to each specification.
AQ105
MCOILTM MC series
－
: Refer to each specification.
LK Series
Measuring frequency
Measuring equipment /jig : 1608,2125⇒4294A＋16092A（or its equivalent）
1005⇒4291A＋16193A（or its equivalent）
Measuring current
: 047～4.7μH ⇒1mArms 、 5.6～33μH ⇒0.1mArms
HK0603、HK1005、AQ Series
Measuring frequency
Test Methods and
Remarks
: 100MHz
Measuring equipment /jig
: HK0603⇒E4991A＋16197A（or its equivalent） , AQ105⇒4291A＋16197A（or its equivalent）
HK1005⇒4291A＋16193A（or its equivalent）
HK1608、HK2125 Series
Measuring frequency
Measuring equipment /jig
HKQ Series
: ～100nH⇒100MHz 、120nH～⇒50MHz
: 4291A＋16092A（or its equivalent）
Measuring frequency
Measuring equipment /jig
: 500MHz
: E4991A＋16197A（or its equivalent）
7. DC Resistance
BK series
BKH series
BKP series
MCF series
CK series
CKS series
CKP series
LK series
Specified Value
Refer to each specification.
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
MCOILTM MC series
Test Methods and
Remarks
Measuring equipment：IWATSU VOAC7512, HIOKI RM3545 (or its equivalent)
8. Self Resonance Frequency（SRF）
BK series
BKH series
－
BKP series
MCF series
CK series
Refer to each specification.
－
CKS series
Specified Value
CKP series
LK series
HK0603, HK1005
HK1608, HK2125
HKQ0603
Refer to each specification.
AQ105
MCOILTM MC series
LK、CK Series :
Measuring equipment
Measuring jig
－
: 4195A（or its equivalent）
Test Methods and
Remarks
: 16092A（or its equivalent）
HK、HKQ、AQ Series :
Measuring equipment
: 8719C（or its equivalent）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E08R01
9. Resistance to Flexure of Substrate
BK series
BKH series
BKP series
MCF series
CK series
CKS series
Specified Value
CKP series
No mechanical damage.
LK series
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
MCOILTM MC series
Warp
: 2mm（BK Series、BKP、BKH1005、CK、CKS、CKP、LK、HK、HKQ0603S、HKQ0603U、AQ Series、MCF1210、MC
Series）
: 1mm（BKH0603、MCF Series without 1210 size,）
Testing board
Thickness
: glass epoxy-resin substrate
: 0.8mm
20
Test Methods and
Remarks
R-230
Board
Warp
Deviation±1
45
45
（Unit：mm）
10. Solderability
BK series
BKH series
BKP series
MCF series
CK series
CKS series
Specified Value
CKP series
At least 90％ of terminal electrode is covered by new solder.
LK series
HK0603, HK1005
HK1608, HK2125
HKQ0603
AQ105
MCOILTM MC series
Solder temperature
Solder temperature
Duration
：230±5℃ (JIS Z 3282 H60A or H63A)
：245±3℃ (Sn/3.0Ag/0.5Cu)
：4±1 sec.
Test Methods and
Remarks
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E08R01
11. Resistance to Soldering
BK series
Appearance：No significant abnormality
Impedance change：Within ±30％
BKH series
BKP series
Appearance：No significant abnormality
MCF series
CK series
Impedance change：Within ±20％
Appearance：No significant abnormality
Inductance change： R10～4R7⇒Within ±10％、 6R8～100⇒Within ±15％
Appearance：No significant abnormality
CKS series
CKP series
Inductance change：Within ±20％
Appearance：No significant abnormality
Specified Value
Inductance change：Within ±30％
Appearance：No significant abnormality
LK series
Inductance change：1005⇒Within ±15％
1608,2125⇒ 47N～4R7: Within ±10％ 5R6～330: Within ±15％
HK0603, HK1005
HK1608, HK2125
HKQ0603
Appearance：No significant abnormality
Inductance change： Within ±5％
AQ105
Appearance：No significant abnormality
Inductance change： Within ±10％
MCOILTM MC series
Solder temperature
Duration
：260±5℃
：10±0.5 sec.
：150 to 180℃
：3 min.
Test Methods and Preheating temperature
Remarks
Preheating time
Flux
：Immersion into methanol solution with colophony for 3 to 5 sec.
Recovery
：2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）
(Note 1) When there are questions concerning measurement result；measurement shall be made after 48±2 hrs of recovery under the standard condition.
12. Thermal Shock
BK series
Appearance：No significant abnormality
BKH series
Impedance change： Within ±30％
BKP series
Appearance：No significant abnormality
MCF series
Impedance change： Within ±20％
CK series
Appearance：No significant abnormality
Inductance change：Within ±20％
CKS series
Appearance：No significant abnormality
Inductance change： Within ±30％
CKP series
LK series
Specified Value
Appearance：No significant abnormality
Inductance change： Within ±10％ Q change： Within ±30％
HK0603, HK1005
HK1608, HK2125
HKQ0603
Appearance：No significant abnormality
Inductance change： Within ±10％ Q change： Within ±20％
AQ105
Appearance：No significant abnormality
Inductance change： Within ±10％
MCOILTM MC series
Conditions for 1 cycle
Step
temperature（℃）
time（min.）
1
2
3
4
Minimum operating temperature ＋0/－3
Room temperature
30±3
2～3
Test Methods and
Remarks
Maximum operating temperature ＋3/－0
Room temperature
30±3
2～3
Number of cycles：5
Recovery：2 to 3 hrs of recovery under the standard condition after the test.（See Note 1）
(Note 1) When there are questions concerning measurement result；measurement shall be made after 48±2 hrs of recovery under the standard condition.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E08R01
13. Damp Heat（ Steady state）
BK series
Appearance：No significant abnormality
Impedance change： Within ±30％
BKH series
BKP series
Appearance：No significant abnormality
Impedance change： Within ±20％
MCF series
CK series
Appearance：No significant abnormality
Inductance change： Within ±20％
CKS series
Appearance：No significant abnormality
Inductance change： Within ±30％
CKP series
Specified Value
Appearance：No significant abnormality
Inductance change： 1005,1608⇒Within ±10％ 2125⇒Within ±20％
Q change： Within ±30％
LK series
HK0603, HK1005
HK1608, HK2125
HKQ0603
Appearance：No significant abnormality
Inductance change： Within ±10％ Q change： Within ±20％
AQ105
Appearance：No significant abnormality
Inductance change： Within ±10％
MCOILTM MC series
BK、BKP、BKH、LK、CK、CKS、CKP、MCF Series：
Temperature ：40±2℃
Humidity
Duration
Recovery
：90 to 95％RH
：500 +24/-0 hrs
：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
Test Methods and
Remarks
HK、HKQ、AQ、MCOILTM MC series：
Temperature ：60±2℃
Humidity
Duration
Recovery
：90 to 95％RH
：500 +24/-0 hrs
：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
(Note 1) When there are questions concerning measurement result；measurement shall be made after 48±2 hrs of recovery under the standard condition.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E08R01
14. Loading under Damp Heat
BK series
Appearance：No significant abnormality
Impedance change： Within ±30％
BKH series
BKP series
MCF series
－
CK series
Appearance：No significant abnormality
Inductance change： Within ±20％
Appearance：No significant abnormality
Inductance change： Within ±30％
Appearance：No significant abnormality
Inductance change： 1005⇒Within ±10％
CKS series
CKP series
Specified Value
LK series
1608⇒0.047～12.0μH： Within ±10％ 15.0～33.0μH： Within ±
15％
2125⇒Within ±20％
Q change： Within ±30％
HK0603, HK1005
HK1608, HK2125
HKQ0603
Appearance：No significant abnormality
Inductance change： Within ±10％ Q change： Within ±20％
AQ105
Appearance：No significant abnormality
Inductance change： Within ±10％
MCOILTM MC series※
BK、BKP、BKH、LK、CK、CKS、CKP Series：
Temperature
Humidity
：40±2℃
：90 to 95％RH
：Rated current
：500 +24/-0 hrs
Applied current
Duration
Recovery
：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
Test Methods and
Remarks
HK、HKQ、AQ、MCOILTM MC Series：
Temperature
Humidity
：60±2℃
：90 to 95％RH
Applied current
Duration
：Rated current ※MC series ; Idc2max
：500 +24/-0 hrs
Recovery
：2 to 3 hrs of recovery under the standard condition after the removal from test chamber.（See Note 1）
Note on standard condition: "standard condition" referred to herein is defined as follows:
5 to 35℃ of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air
pressure.
Unless otherwise specified, all the tests are conducted under the "standard condition."
(Note 1) Measurement shall be made after 48±2 hrs of recovery under the standard condition.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E08R01
15. Loading at High Temperature
BK series
Appearance：No significant abnormality
Impedance change： Within ±30％
BKH series
BKP series
Appearance：No significant abnormality
Impedance change： Within ±20％
Appearance：No significant abnormality
Inductance change： Within ±20％
Appearance：No significant abnormality
Inductance change： Within ±30％
Appearance：No significant abnormality
Inductance change： 1005⇒Within ±10％
MCF series
CK series
CKS series
CKP series
Specified Value
LK series
1608⇒0.047～12.0μH： Within ±10％ 15.0～33.0μH： Within ±
15％
2125⇒Within ±20％
Q change： Within ±30％
HK0603, HK1005
HK1608, HK2125
HKQ0603
Appearance：No significant abnormality
Inductance change： Within ±10％ Q change： Within ±20％
AQ105
Appearance：No significant abnormality
Inductance change： Within ±10％
MCOILTM MC series※
Temperature : Maximum operating temperature
Test Methods and
Remarks
Applied current ：Rated current ※MC series ; Idc2max
Duration
：500 +24/-0 hrs
Recovery
：2 to 3 hrs of recovery under the standard condition after the removal from test chamber. （See Note 1）
Note on standard condition: "standard condition" referred to herein is defined as follows:
5 to 35℃ of temperature, 45 to 85% relative humidity, and 86 to 106kPa of air pressure.
When there are questions concerning measurement results:
In order to provide correlation data, the test shall be conducted under condition of 20±2℃ of temperature, 60 to 70% relative humidity, and 86 to 106kPa of air
pressure. Unless otherwise specified, all the tests are conducted under the "standard condition."
(Note 1) Measurement shall be made after 48±2 hrs of recovery under the standard condition.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_reli_e-E08R01
Precautions on the use of Multilayer chip inductors
Multilayer chip inductors for high frequency, Multilayer chip bead inductors
Multilayer common mode choke coils（MC series F type）
■PRECAUTIONS
1. Circuit Design
◆Verification of operating environment, electrical rating and performance
1. A malfunction in medical equipment, spacecraft, nuclear reactors, etc. may cause serious harm to human life or have severe social
ramifications.
As such, any inductors to be used in such equipment may require higher safety and/or reliability considerations and should be clearly
Precautions
differentiated from components used in general purpose applications.
◆Operating Current（Verification of Rated current）
1. The operating current including inrush current for inductors must always be lower than their rated values.
2. Do not apply current in excess of the rated value because the inductance may be reduced due to the magnetic saturation effect.
2. PCB Design
◆Pattern configurations（Design of Land-patterns）
1. When inductors are mounted on a PCB, the size of land patterns and the amount of solder used（size of fillet）can directly affect inductor
performance.
Therefore, the following items must be carefully considered in the design of solder land patterns:
（1） The amount of solder applied can affect the ability of chips to withstand mechanical stresses which may lead to breaking or
cracking. Therefore, when designing land-patterns it is necessary to consider the appropriate size and configuration of the solder
pads which in turn determines the amount of solder necessary to form the fillets.
（2） When more than one part is jointly soldered onto the same land or pad, the pad must be designed so that each component's
Precautions
soldering point is separated by solder-resist.
（3） The larger size of land patterns and amount of solder, the smaller Q value after mounting on PCB. It makes higher the Q value to
design land patterns smaller than terminal electrode of chips.
◆Pattern configurations（Inductor layout on panelized［ breakaway］ PC boards）
1. After inductors have been mounted on the boards, chips can be subjected to mechanical stresses in subsequent manufacturing
processes （PCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering the reflow soldered
boards etc.）For this reason, planning pattern configurations and the position of SMD inductors should be carefully performed to
minimize stress.
◆Pattern configurations（Design of Land-patterns）
1. The following diagrams and tables show some examples of recommended patterns to prevent excessive solder amounts（larger fillets
which extend above the component end terminations）. Examples of improper pattern designs are also shown.
（1） Recommended land dimensions for a typical chip inductor land patterns for PCBs
Land pattern
●Recommended land dimensions for Multilayer inductor
Solder-resist
Chip inductor
Wave-soldering （Unit：mm）
Type
1608
1.6
2012
2.0
2125
2.0
2016
2.0
2520
2.5
3216
3.2
C
L
Size
W
0.8
1.25
1.25
1.6
2.0
1.6
B
A
B
A
B
C
0.8～1.0
0.5～0.8
0.6～0.8
1.0～1.4
0.8～1.5
0.9～1.2
1.0～1.4
0.8～1.5
0.9～1.2
1.0～1.4
0.8～1.5
1.3～1.6
1.0～1.4
0.6～1.0
1.6～2.0
1.8～2.5
0.8～1.7
1.2～1.6
Chip inductor
W
L
Reflow-soldering （Unit：mm）
Technical
Type
0603
0.6
1005
1.0
105
1.0
0.6
1608
1.6
2012
2.0
2125
2.0
2016
2.0
2520
2.5
3216
3.2
considerations
L
Size
W
0.3
0.5
0.8
1.25
1.25
1.6
2.0
1.6
A
B
C
0.20～0.30 0.45～0.55 0.50～0.55
0.20～0.30 0.40～0.50 0.30～0.40
0.25～0.40 0.45～0.55 0.60～0.70
0.8～1.0
0.6～0.8
0.6～0.8
0.8～1.2
0.8～1.2
0.9～1.6
0.8～1.2
0.8～1.2
0.9～1.6
0.8～1.2
0.8～1.2
1.2～2.0
1.0～1.4
0.6～1.0
1.8～2.2
1.8～2.5
0.6～1.5
1.2～2.0
●Recommended land dimension for Array type
(Unit：mm）
c
d
Type
2010
2.0
3216
3.2
a
b
L
Size
W
1.0
1.6
W
a
b
c
d
0.5～0.6
0.5～0.6
0.2～0.3
0.5
0.7～0.9
0.8～1.0
0.4～0.5
0.8
a
L
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_prec_e-E08R01
●Recommended land dimension for Multilayer common mode choke coil
（Unit：mm）
（Unit：mm）
c
c
Type
0605
0.65
0.50
0806
0.85
0.65
Type
1210
1.0
L
L
Size
a
b
a
b
a
Size
W
W
1.25
a
a
b
c
d
0.27～0.30 0.25～0.35
0.17～0.20 0.25～0.35
0.20～0.26 0.25～0.35
W
a
b
c
d
0.45～0.55
0.7～0.8
0.25～0.35
0.55
d
L
W
d
L
a
0.4
0.5
（2） Examples of good and bad solder application
Item
Not recommended
Lead wire of component
Recommended
Solder-resist
Mixed mounting of SMD and
leaded components
Chassis
Solder-resist
Solder (for grounding)
Component placement close to
the chassis
Electrode pattern
Lead wire of component
Soldering iron
Solder-resist
Hand-soldering of leaded
components near mounted
components
Solder-resist
Horizontal component
placement
◆Pattern configurations（Inductor layout on panelized［ breakaway］ PC boards）
1-1. The following are examples of good and bad inductor layout; SMD inductors should be located to minimize any possible mechanical
stresses from board warp or deflection.
Item
Not recommended
Recommended
Position the component at a
right angle to the direction of
the mechanical stresses that
are anticipated.
Deflection of the board
1-2. To layout the inductors for the breakaway PC board, it should be noted that the amount of mechanical stresses given will vary
depending on inductor layout.
An example below should be counted for better design.
E
D
Perforation
C
A
B
Slit
Magnitude of stress A＞B＝C＞D＞E
1-3. When breaking PC boards along their perforations, the amount of mechanical stress on the inductors can vary according to the
method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and
perforation. Thus, any ideal SMD inductor layout must also consider the PCB splitting procedure.
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_prec_e-E08R01
3. Considerations for automatic placement
◆Adjustment of mounting machine
1. Excessive impact load should not be imposed on the inductors when mounting onto the PC boards.
2. The maintenance and inspection of the mounter should be conducted periodically.
◆Selection of Adhesives
Precautions
1. Mounting inductors with adhesives in preliminary assembly, before the soldering stage, may lead to degraded inductor characteristics
unless the following factors are appropriately checked; the size of land patterns, type of adhesive, amount applied, hardening
temperature and hardening period. Therefore, it is imperative to consult the manufacturer of the adhesives on proper usage and
amounts of adhesive to use.
◆Adjustment of mounting machine
1. If the lower limit of the pick-up nozzle is low, too much force may be imposed on the inductors, causing damage. To avoid this, the
following points should be considered before lowering the pick-up nozzle:
（1） The lower limit of the pick-up nozzle should be adjusted to the surface level of the PC board after correcting for deflection of the
board.
（2） The pick-up pressure should be adjusted between 1 and 3N static loads.
（3） To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins should be
used under the PC board. The following diagrams show some typical examples of good pick-up nozzle placement:
Item
Improper method
Proper method
chipping
or cracking
Single-sided mounting
supporting pins
or back-up pins
Double-sided mounting
chipping
or cracking
supporting pins
or back-up pins
Technical
2. As the alignment pin wears out, adjustment of the nozzle height can cause chipping or cracking of the inductors because of mechanical
impact on the inductors. To avoid this, the monitoring of the width between the alignment pin in the stopped position, and maintenance,
inspection and replacement of the pin should be conducted periodically.
considerations
◆Selection of Adhesives
1. Some adhesives may cause reduced insulation resistance. The difference between the shrinkage percentage of the adhesive and that of
the inductors may result in stresses on the inductors and lead to cracking. Moreover, too little or too much adhesive applied to the
board may adversely affect component placement, so the following precautions should be noted in the application of adhesives.
（1） Required adhesive characteristics
a. The adhesive should be strong enough to hold parts on the board during the mounting & solder process.
b. The adhesive should have sufficient strength at high temperatures.
c. The adhesive should have good coating and thickness consistency.
d. The adhesive should be used during its prescribed shelf life.
e. The adhesive should harden rapidly.
f. The adhesive must not be contaminated.
g. The adhesive should have excellent insulation characteristics.
h. The adhesive should not be toxic and have no emission of toxic gasses.
（2） When using adhesives to mount inductors on a PCB, inappropriate amounts of adhesive on the board may adversely affect
component placement. Too little adhesive may cause the inductors to fall off the board during the solder process. Too much
adhesive may cause defective soldering due excessive flow of adhesive on to the land or solder pad.
［Recommended conditions］
Amount of adhesives
a
After inductors are bonded
a
Figure
0805 case sizes as examples
a
b
c
0.3mm min
100～120μm
b
Area with no adhesive
c
c
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_prec_e-E08R01
4. Soldering
Precautions
◆Selection of Flux
1. Since flux may have a significant effect on the performance of inductors, it is necessary to verify the following conditions prior to use;
（1） Flux used should be with less than or equal to 0.1 wt% （Chlorine conversion method） of halogenated content. Flux having a strong
acidity content should not be applied.
（2） When soldering inductors on the board, the amount of flux applied should be controlled at the optimum level.
（3） When using water-soluble flux, special care should be taken to properly clean the boards.
◆Soldering
1. Temperature, time, amount of solder, etc. are specified in accordance with the following recommended conditions, and please contact us
about peak temperature when you use lead-free paste.
◆Selection of Flux
1-1. When too much halogenated substance（Chlorine, etc.）content is used to activate the flux, or highly acidic flux is used, an excessive
amount of residue after soldering may lead to corrosion of the terminal electrodes or degradation of insulation resistance on the
surface of the Inductor.
1-2. Flux is used to increase solderability in flow soldering, but if too much is applied, a large amount of flux gas may be emitted and may
detrimentally affect solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system.
1-3. Since the residue of water-soluble flux is easily dissolved by water content in the air, the residue on the surface of Inductor in high
humidity conditions may cause a degradation of insulation resistance and therefore affect the reliability of the components. The
cleaning methods and the capability of the machines used should also be considered carefully when selecting water-soluble flux.
◆Soldering
1-1. Preheating when soldering
Preheating: Inductors shall be preheated sufficiently, and the temperature difference between the inductors and solder shall be within
130°C.
Cooling: The temperature difference between the components and cleaning process should not be greater than 100℃.
Inductors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. Therefore, the soldering
process must be conducted with a great care so as to prevent malfunction of the components due to excessive thermal shock.
［Reflow soldering］
【Recommended condition for Pb-free soldering】 Caution
1. Solder (fillet) should wet up to 1/2 to 1/3 of the thickness of an inductor
ideally as shown below:
300
200
100
0
Peak
260℃ Max.
Within 10sec.
1/2T～1/3T
Inductor
Solder
T
Slow
cooling
PC board
2. Because excessive dwell time can detrimentally affect solderability,
soldering duration shall be kept as close to recommended time as possible.
3. The allowable number of reflow soldering is two (2) times.
Heating above
230℃
40sec. Max.
Preheating150℃
60sec. Min.
Technical
considerations
［Wave soldering］
【Recommended condition for Pb-free soldering】 Caution
300
200
100
0
1. Make sure the inductors are preheated sufficiently.
2. The temperature difference between the inductor and melted solder
should be within 130℃.
Peak
260℃ Max.
Within 10sec.
120sec. Min.
3. Cooling after soldering should be as gradual as possible.
4. The allowable number of wave soldering is one (1) time.
5. Wave soldering must not be applied to the inductors designated as for
reflow soldering only.
Slow
Preheating
150℃
cooling
［Hand soldering］
【Recommended condition for Pb-free soldering】 Caution
400
300
200
100
0
1. It is recommended to use a 20W soldering iron with a maximum tip
diameter of 1.0 mm.
Peak
350℃ Max.
Within 3sec.
2. The soldering iron shall not directly touch inductors
3. The allowable number of hand soldering is one (1) time
⊿T
Slow cooling
Preheating
150℃ Min.
60sec. Min.
（※⊿Ｔ≦150℃）
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_prec_e-E08R01
5. Cleaning
Precautions
◆Cleaning conditions
1. When cleaning the PC board after the Inductors are all mounted, select the appropriate cleaning solution according to the type of flux
used and purpose of the cleaning（e.g. to remove soldering flux or other materials from the production process.）
2. Cleaning conditions should be determined after verifying, through a test run, that the cleaning process does not affect the inductor's
characteristics.
◆Cleaning conditions
1. The use of inappropriate solutions can cause foreign substances such as flux residue to adhere to the inductor, resulting in a degradation
of the inductor's electrical properties（especially insulation resistance）.
2. Inappropriate cleaning conditions（insufficient or excessive cleaning）may detrimentally affect the performance of the inductors.
In the case of ultrasonic cleaning, too much power output can cause excessive vibration of the PC board which may lead to the cracking
of the inductor or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions should be
carefully checked;
Technical
considerations
Ultrasonic output
20W/ℓ or less
40kHz or less
5 min. or less
Ultrasonic frequency
Ultrasonic washing period
6. Resin coating and mold
1. With some type of resins a decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while
left under normal storage conditions resulting in the deterioration of the inductor's performance.
2. Thermal expansion and thermal shrinkage characteristics of resins may lead to the deterioration of inductors’ performance.
3. When a resin hardening temperature is higher than inductor operating temperature, the stresses generated by the excessive heat may
lead to damage in inductors.
Precautions
7. Handling
◆Breakaway PC boards（splitting along perforations）
1. When splitting the PC board after mounting inductors and other components, care is required so as not to give any stresses of deflection
or twisting to the board.
2. Board separation should not be done manually, but by using the appropriate devices.
◆General handling precautions
・Always wear static control bands to protect against ESD.
・ Keep the inductors away from all magnets and magnetic objects.
・ Use non-magnetic tweezers when handling inductors.
Precautions
・ Any devices used with the inductors（ soldering irons, measuring instruments） should be properly grounded.
・ Keep bare hands and metal products（i.e., metal desk）away from inductor electrodes or conductive areas that lead to chip electrodes.
・ Keep inductors away from items that generate magnetic fields such as speakers or coils.
◆Mechanical considerations
Be careful not to subject the inductors to excessive mechanical shocks.
（1） If inductors are dropped on the floor or a hard surface they should not be used.
（2） When handling the mounted boards, be careful that the mounted components do not come in contact with or bump against other
boards or components.
8. Storage conditions
◆Storage
To maintain the solderability of terminal electrodes and to keep the packaging material in good condition, care must be taken to control
temperature and humidity in the storage area. Humidity should especially be kept as low as possible.
・Recommended conditions
Precautions
Ambient temperature: 30℃ or below
Humidity: 70% RH or below
The ambient temperature must be kept below 40℃. Even under ideal storage conditions, solderability of inductor is deteriorated as time
passes, so inductors should be used within 6 months from the time of delivery.
・Inductor should be kept where no chlorine or sulfur exists in the air.
◆Storage
Technical
If the parts are stocked in a high temperature and humidity environment, problems such as reduced solderability caused by oxidation of
terminal electrodes and deterioration of taping/packaging materials may take place. For this reason, components should be used within 6
months from the time of delivery. If exceeding the above period, please check solderability before using the inductors.
considerations
▶ This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification.
For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) .
i_mlci_prec_e-E08R01
相关型号：
©2020 ICPDF网 联系我们和版权申明